NUST Institutions Library Catalogue

Integrated Circuits Building Blocks of microelectronics W.Henning

By: W.Henning | H.JahnPublisher: Germany Siemens 1989Description: various pagingSubject(s): W.Henning | Telecommunication engineeringDDC classification: 621.3815
Contents:
Integrated Circuits (Page-1), From Concept To Product (Page-2), VLSI Design Sequence (Page-3), Designing Integrated Circuits With CAE Sys (Page-4), Entering Logic Cells Into The Computer (Page-5), Resolving The Machine Layout Into Separate Masks (Page-6), Developing The Overall Circuit (Page-7), Plotter Produces Integrated Circuit Layout (Page-8), Producing The Mask Set Using An Electron Beam Writer (Page-9), Masks For Integrated Circuits (Page-10), Fabricating The Integrated Circuit (Page-11), Cleaning The Surface Of The Silicon Slices (Page-12), Oxidizing The Silicon Slices (Page-13), Coating The Oxide With A Light-Sensitive Resist (Page-14), Adjustment Before Exposure To Light (Page-15), Exposing The Resist Through The Mask (Page-16), Developing The Photoresist, Chemically Removing The Exposed Section (Page-17), Visually Checking The Process Steps (Page-18), Removing The Oxide And Photoresist (Page-19), Diffusing The Oxide-Masked Silicon Slices (Page-20), Implanting The Oxide-Masked Silicon Slices (Page-21), What Happens During Diffusion And Implantation (Page-22), Coating The Whole Surface With Aluminum (Page-23), Finished Integrated Circuit (Page-25), Intermediate Electrical Test (Page-26), Sawing The Slice Into Individual Chips (Page-27), Pasting The Chips Onto The Mount (Page-28), Forming Electrical Connections Between The Circuit Junctions And Mount Terminals (Page-29), Fully Automatic Final Testing (Page-30), Various Types Of Packages For Integrated Circuits (Page-31).
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Item type Current location Home library Collection Call number URL Status Date due Barcode Item holds
Book Book Military College of Signals (MCS)
Military College of Signals (MCS)
NFIC 621.3815 INT (Browse shelf) Link to resource Available MCS1079
Total holds: 0

Integrated Circuits (Page-1), From Concept To Product (Page-2), VLSI Design Sequence (Page-3), Designing Integrated Circuits With CAE Sys (Page-4), Entering Logic Cells Into The Computer (Page-5), Resolving The Machine Layout Into Separate Masks (Page-6), Developing The Overall Circuit (Page-7), Plotter Produces Integrated Circuit Layout (Page-8), Producing The Mask Set Using An Electron Beam Writer (Page-9), Masks For Integrated Circuits (Page-10), Fabricating The Integrated Circuit (Page-11), Cleaning The Surface Of The Silicon Slices (Page-12), Oxidizing The Silicon Slices (Page-13), Coating The Oxide With A Light-Sensitive Resist (Page-14), Adjustment Before Exposure To Light (Page-15), Exposing The Resist Through The Mask (Page-16), Developing The Photoresist, Chemically Removing The Exposed Section (Page-17), Visually Checking The Process Steps (Page-18), Removing The Oxide And Photoresist (Page-19), Diffusing The Oxide-Masked Silicon Slices (Page-20), Implanting The Oxide-Masked Silicon Slices (Page-21), What Happens During Diffusion And Implantation (Page-22), Coating The Whole Surface With Aluminum (Page-23), Finished Integrated Circuit (Page-25), Intermediate Electrical Test (Page-26), Sawing The Slice Into Individual Chips (Page-27), Pasting The Chips Onto The Mount (Page-28), Forming Electrical Connections Between The Circuit Junctions And Mount Terminals (Page-29), Fully Automatic Final Testing (Page-30), Various Types Of Packages For Integrated Circuits (Page-31).

Almirah No.34 Shelf No.4

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