Failure mechanisms in semiconductor devices / E.A. Amerasekera and D.S. Campbell.
Publisher: Chichester [West Sussex] ; New York : Wiley, c1987Description: xiii, 205 p. : ill. ; 24 cmISBN: 0471914347 :Subject(s): Telecommunication EngineeringDDC classification: 621.38152,AME Online resources: Publisher description | Table of contents only
Contents:
Introduction (Page-1), Reliability Theory (Page-5), Failure Mechanisms (Page-12), Failure Mechanisms and Device Technologies (Page-66), Packing (Page-93), Screening (Page-105), Accelerated Testing (Page-116), Physical Failure Analysis Technology (Page-121), Reliability Prediction and Failure Modeling (Page-129), Quality Assurance (Page-135), Conclusions (Page-143).
| Item type | Current location | Home library | Shelving location | Call number | URL | Status | Notes | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|---|---|
Book
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Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.38152,AME (Browse shelf) | Link to resource | Available | Almirah No.33, Shelf No.4 | MCS7390 |
Total holds: 0
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| 621.38152,ALL Semiconductor devices and circuits / | 621.38152,ALL Semiconductor devices and circuits / | 621.38152,ALL CMOS analog circuit design / | 621.38152,AME Failure mechanisms in semiconductor devices / | 621.38152,BAK CMOS circuit design, layout, and simulation / | 621.38152,BAK CMOS circuit design, layout, and simulation / | 621.38152,BAK CMOS circuit design, layout, and simulation / |
Introduction (Page-1), Reliability Theory (Page-5), Failure Mechanisms (Page-12), Failure Mechanisms and Device Technologies (Page-66), Packing (Page-93), Screening (Page-105), Accelerated Testing (Page-116), Physical Failure Analysis Technology (Page-121), Reliability Prediction and Failure Modeling (Page-129), Quality Assurance (Page-135), Conclusions (Page-143).
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