Process engineering analysis in semiconductor device fabrication / Stanley Middleman, Arthur K. Hochberg.
Series: McGraw-Hill chemical engineering seriesPublisher: New York : McGraw-Hill, c1993Description: xvii, 774 p. : ill. ; 25 cmISBN: 0071127445Subject(s): Telecommunication EngineeringDDC classification: 621.38152,MID
Contents:
Some Background in the Physics of Solids (Page -1), Device Background (Page -28), Process Modeling (Page -67), Cleanliness and Purity in the Process Environment Filtration of Particulates (Page -114), Particle Deposition and Removal (Page -161), Production and Maintenances of Purity in Process (Page -197), Silicon Production (Page -230), Oxidation of Silicon (Page -260), Microlithography (Page -285), Doping (Page -330), Etching (Page -392), Chemical Vapor Deposition (Page -478), Ion Implantation (Page -595), Metallization (Page -662).
| Item type | Current location | Home library | Shelving location | Call number | URL | Status | Notes | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|---|---|---|
Book
|
Military College of Signals (MCS) | Military College of Signals (MCS) | General Stacks | 621.38152,MID (Browse shelf) | Link to resource | Available | Almirah No.33, Shelf No.5 | MCS22639 |
Total holds: 0
Browsing Military College of Signals (MCS) shelves, Shelving location: General Stacks Close shelf browser
| No cover image available | No cover image available | |||||||
| 621.38152,LIN Linear supplement databook | 621.38152,MAY Fundamentals of Semiconductor Fabrication / | 621.38152,MAY Electronic materials science : for integrated circuits in Si and GaAs / | 621.38152,MID Process engineering analysis in semiconductor device fabrication / | 621.38152,MOD Molecular electronic devices / | 621.38152,MUL Device electronics for integrated circuits / | 621.38152,MUL Semiconductor devices measurements / |
Some Background in the Physics of Solids (Page -1), Device Background (Page -28), Process Modeling (Page -67), Cleanliness and Purity in the Process Environment Filtration of Particulates (Page -114), Particle Deposition and Removal (Page -161), Production and Maintenances of Purity in Process (Page -197), Silicon Production (Page -230), Oxidation of Silicon (Page -260), Microlithography (Page -285), Doping (Page -330), Etching (Page -392), Chemical Vapor Deposition (Page -478), Ion Implantation (Page -595), Metallization (Page -662).
There are no comments on this title.