The Technology of Printed Circuits : The foil Technique in electronic production / Paul Eisler

By: Paul EislerPublisher: london Heywood 1959Description: 405pSubject(s): Telecommunication EngineeringDDC classification: 621.38153,EIS
Contents:
The Basic Story of Printed Circuits (Page-1), The Confused Start of a New Technology (Page-7), The Principles of Method Selection and the Foil Tech (Page-28), Watching Printed Circuits Production (Page-42), Form the Drawing to the Photo-Stencil (Page-72), Litho Printing (Page-90), Photomechanical Printing Processes (Page-96), Plating and the Foil Tech (Page-111), Ancillary Operations (Page-132), Laboratory Routine (Page-146), Design (Page-159), Conventional Components for Assembly (Page-185), Printed Circuits Trouble Shooting (Page-192), Automatic Assembly in the Electronic (Page-205), Regeneration of Ferric Chloride (Page-223), Weight Saving and Heat Dissipation (Page-232), Miniaturization (Page-242), Oriented Components (Page-253), Microwave Printed Circuits (Page-281), Printed Circuits and The Electronics Industry (Page-303).
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Item type Current location Home library Shelving location Call number URL Status Notes Date due Barcode Item holds
Book Book Military College of Signals (MCS)
Military College of Signals (MCS)
General Stacks 621.38153,EIS (Browse shelf) Link to resource Available Almirah No.34, Shelf No.2 MCS5527
Total holds: 0

The Basic Story of Printed Circuits (Page-1), The Confused Start of a New Technology (Page-7), The Principles of Method Selection and the Foil Tech (Page-28), Watching Printed Circuits Production (Page-42), Form the Drawing to the Photo-Stencil (Page-72), Litho Printing (Page-90), Photomechanical Printing Processes (Page-96), Plating and the Foil Tech (Page-111), Ancillary Operations (Page-132), Laboratory Routine (Page-146), Design (Page-159), Conventional Components for Assembly (Page-185), Printed Circuits Trouble Shooting (Page-192), Automatic Assembly in the Electronic (Page-205), Regeneration of Ferric Chloride (Page-223), Weight Saving and Heat Dissipation (Page-232), Miniaturization (Page-242), Oriented Components (Page-253), Microwave Printed Circuits (Page-281), Printed Circuits and The Electronics Industry (Page-303).

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