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Materials developments in microelectronic packaging performance reliability proceedings of the fourth electronic materials and processing congresses

By: Singh, Prabjit Material type: Text

TextPublisher: USA ASM INTERNATIONAL 1991Description: XI, 403PSubject(s): 0-87170-435-8DDC classification: 621.381 MAT'E

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Item type	Current location	Home library	Shelving location	Call number	Status	Date due	Barcode	Item holds
Book	College of Electrical & Mechanical Engineering (CEME)	College of Electrical & Mechanical Engineering (CEME)	General Stacks	621.381 MAT'E (Browse shelf)	Available		CEME-30527

Total holds: 0

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