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The development of electronic devices towards high performance and miniaturization has led
to an increase in the heat dissipation problem. Traditional air-cooling methods are no longer
sufficient to meet the high-density heat dissipation requirements. The thermal design optimization
of heat sinks is necessary to minimize size and weight and improve heat removal, which can
increase the speed of electronic devices. The use of sophisticated technology and proper design of
heat sinks is crucial to avoid overheating and damage to electronic components. Porous metal has
been shown to enhance forced convection heat transfer for better heat removal. However, the highpressure drop associated with porous medium also needs to be considered in the design. The
effective thermal management of heat sinks is a priority concern for researchers as overheating
can threaten chip reliability and lifespan. The average heat flux of chips has increased from 50
W/cm2 in 2010 to 250 W/cm2 in 2012, which highlights the importance of effective thermal
management. In addition, the use of micro-channel compact heat exchangers and flow boiling in
mini- and micro channels have been suggested as effective cooling methods for high power density
devices such as Micro Electromechanical Systems (MEMS), microprocessors, laser diode arrays
and Light Emitting Diodes (LEDs). In this study, we will be investigating the effect of nontraditional geometries of heat-sinks for high power electronics used in aerospace applications.