Area Array Packaging Materials Adhesive, Pestes, and Lead- Free

By: .Phd, . Gilleo KenMaterial type: TextTextPublisher: New York: McGraw-Hill, 2004ISBN: 9780071428286Subject(s): Area Array Packaging MaterialsDDC classification: 621.38104
Tags from this library: No tags from this library for this title. Log in to add tags.
Item type Current location Home library Shelving location Call number Status Date due Barcode Item holds
Book Book College of Electrical & Mechanical Engineering (CEME)
College of Electrical & Mechanical Engineering (CEME)
General Stacks 621.38104 GIl (Browse shelf) Available CEME- 41969
Total holds: 0

There are no comments on this title.

to post a comment.
© 2023 Central Library, National University of Sciences and Technology. All Rights Reserved.