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Adhesive bonding is a critical technique in modern engineering, providing lightweight, highstrength joints for diverse applications in aerospace, automotive, and construction industries. This
study explores the enhancement of epoxy-based adhesive performance through the incorporation
of Ti₃C₂ MXene nanofillers, focusing on the tensile strength and thermal stability of single-lap
joints (SLJs). Experimental testing was conducted on SLJs at three temperatures (25°C, 40°C, and
60°C) with varying MXene concentrations (0.25 wt.%, 0.50 wt.%, 0.75 wt.%, 1.00 wt.%, and 1.25
wt.%).
The study revealed that MXene nanofillers significantly enhance adhesive performance. The
highest tensile strength was observed at 1.0 wt.% MXene at 25°C and 1.25 wt.% MXene at 40°C
and 60°C. Ti₃C₂ nanofiller reinforced adhesives demonstrated up to a 95.5% increase in tensile
strength at elevated temperatures compared to neat epoxy, highlighting their superior thermal
stability and mechanical reliability. At low concentrations (0.25 wt.%), the addition of MXene led
to a reduction in failure load, emphasizing the need to optimize nanofiller content for maximum
performance.While the results are promising, the study had some limitations. For instance, the Ti₃C₂ MXene
used was unprocessed and not further etched into 2D nanosheets, which could potentially enhance
its effectiveness. Additionally, the study did not assess long-term environmental resistance, such
as exposure to moisture, UV radiation, or cyclic loading. To build on these findings, future work
could explore functionalization of 2D Ti₃C₂ MXene, hybrid nanofiller systems (combining MXene
with other nanomaterials), conduct durability tests under realistic environmental conditions, and scale up experiments to evaluate performance in industrial applications. These steps would provide
a more comprehensive understanding of MXene's potential in advanced adhesive technologies.
This research provides valuable insights into the design and optimization of MXene-reinforced
adhesives, contributing to the development of lightweight, high-performance bonding solutions
for modern engineering challenges.