TY  - GEN
AU  - Harman, George G
AU  - George G. Harman
TI  - Wire bonding in microelectronics
SN  - 9780071476232
U1  - 621.3815 
PY  - 2010///
CY  - New York
PB  - Mc Graw Hill
KW  - Electronic packaging--Defects
ER  -