TY  - GEN
AU  - W.Henning
ED  - H.Jahn
TI  - Integrated Circuits Building Blocks of microelectronics
U1  - 621.3815 
PY  - 1989///
CY  - Germany
PB  - Siemens
KW  - W.Henning
KW  - Telecommunication engineering
N1  - Integrated Circuits (Page-1), From Concept To Product (Page-2), VLSI Design Sequence (Page-3), Designing Integrated Circuits With CAE Sys (Page-4), Entering Logic Cells Into The Computer (Page-5), Resolving The Machine Layout Into Separate Masks (Page-6), Developing The Overall Circuit (Page-7), Plotter Produces Integrated Circuit Layout (Page-8), Producing The Mask Set Using An Electron Beam Writer (Page-9), Masks For Integrated Circuits (Page-10), Fabricating The Integrated Circuit (Page-11), Cleaning The Surface Of The Silicon Slices (Page-12), Oxidizing The Silicon Slices (Page-13), Coating The Oxide With A Light-Sensitive Resist (Page-14), Adjustment Before Exposure To Light (Page-15), Exposing The Resist Through The Mask (Page-16), Developing The Photoresist, Chemically Removing The Exposed Section (Page-17), Visually Checking The Process Steps (Page-18), Removing The Oxide And Photoresist (Page-19), Diffusing The Oxide-Masked Silicon Slices (Page-20), Implanting The Oxide-Masked Silicon Slices (Page-21), What Happens During Diffusion And Implantation (Page-22), Coating The Whole Surface With Aluminum (Page-23), Finished Integrated Circuit (Page-25), Intermediate Electrical Test (Page-26), Sawing The Slice Into Individual Chips (Page-27), Pasting The Chips Onto The Mount (Page-28), Forming Electrical Connections Between The Circuit Junctions And Mount Terminals (Page-29), Fully Automatic Final Testing (Page-30), Various Types Of Packages For Integrated Circuits (Page-31)
ER  -