TY  - GEN
AU  - Middleman,Stanley
AU  - Hochberg,Arthur K.
TI  - Process engineering analysis in semiconductor device fabrication
SN  - 0071127445
U1  - 621.38152,MID 
PY  - 1993///
CY  - New York
PB  - McGraw-Hill
KW  - Telecommunication Engineering
N1  - Some Background in the Physics of Solids (Page -1), Device Background (Page -28), Process Modeling (Page -67), Cleanliness and Purity in the Process Environment Filtration of Particulates (Page -114), Particle Deposition and Removal  (Page -161), Production and Maintenances of Purity in Process (Page -197), Silicon Production (Page -230), Oxidation of Silicon (Page -260), Microlithography (Page -285), Doping (Page -330), Etching (Page -392), Chemical Vapor Deposition (Page -478), Ion Implantation (Page -595), Metallization (Page -662).
ER  -