TY - GEN AU - Shugg, W. Tillar TI - Handbook of Electrical & Electronic Insulating Materials SN - 8172249829 U1 - 621.381,SHU PY - 2002/// CY - Mumbai PB - jaico publishing house KW - Telecommunication Engineering N1 - Fundamentals(Page-1), Thermoplastic Molding Compounds (Page-13), Thermosetting Molding Compounds (Page-87), Extrusion Compounds (Page-111), Embedding Compounds (Page-155), Magnet Wire Enamels (Page-177), Insulating Coatings and Impregnants (Page-223), Unclad and Clad Structures(Page-255), Dielectric Films (Page-291), Dielectric Papers and Boards (Page-319),Tapes and Coated Fabric (Page-335), Tubing and Sleeving (Page-381), Mica and Mica Products (Page-419), Ceramic and Glass Insulations (Page-435), Dielectric Gases (Page-451), Dielectric Liquids (Page-471), Industry Activities (Page-495), Government Activities (Page-513) ER -