TY  - GEN
AU  - Paul Eisler
TI  - The Technology of Printed Circuits: The foil Technique in electronic production 
U1  - 621.38153,EIS 
PY  - 1959///
CY  - london
PB  - Heywood
KW  - Telecommunication Engineering
N1  - The Basic Story of Printed Circuits (Page-1), The Confused Start of a New Technology (Page-7), The Principles of Method Selection and the Foil Tech (Page-28), Watching Printed Circuits Production (Page-42), Form the Drawing to the Photo-Stencil (Page-72), Litho Printing  (Page-90), Photomechanical Printing Processes (Page-96), Plating and the Foil Tech (Page-111),  Ancillary Operations (Page-132), Laboratory Routine (Page-146), Design (Page-159), Conventional Components for Assembly (Page-185), Printed Circuits Trouble Shooting (Page-192), Automatic Assembly in the Electronic (Page-205), Regeneration of Ferric Chloride (Page-223), Weight Saving and Heat Dissipation (Page-232), Miniaturization  (Page-242), Oriented Components (Page-253), Microwave Printed Circuits (Page-281), Printed Circuits and The Electronics Industry (Page-303).
ER  -