Gerald A. Walker <br/><br/>
Advances in electronic circuit packaging Vol-2 / 
Gerald A. Walker 
 - New York   Englewood, Colo., Rogers  1962 
 - 381 p 
<br/><br/>Materials for Electronic Packaging (Page-1), Controlling the Mechanical Response of Printed Circuits Boards (Page-21), A Low Density Potting Compound (Page-35), An Effective use of Castings in a Lightweight (Page-52), Heat Sinks and Encapsulates for Volumetric Packing (Page-61), Potting Problems Related to Packing Design (Page-77), Packing of Semiconductor Networks (Page-91),Theremal packing for Transient Operation (Page-104), Formulation and Solution of the Circuit Card Design Problems (Page-121), Maintainable Electronic Component Assemblies (Page-143), Electronic Packing (Page-166), Packing of a Telemeter to Withstand (Page-181), 
<br/><br/><label>Dewey Class. No.: </label>621.38132,ADV