TY  - BOOK
AU  - Xiao,Hong
TI  - Introduction to semiconductor technology
SN  - 9780819490926
AV  - TK7871.85 .X53 2012
U1  - 621.3815/2 23
PY  - 2012///
CY  - Bellingham, Wash.
PB  - SPIE
KW  - Semiconductors
KW  - Design and construction
KW  - Semiconductor industry
N1  - Includes bibliographical references and index; Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index; License restrictions may limit access
UR  - http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379
ER  -