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Electronics manufacturing : with lead-free, halogen-free, and conductive-adhesive materials / John H. Lau ... [et al.].

by Lau, John H | Lau, John H.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: New York, NY : McGraw-Hill, c2003Online access: Contributor biographical information | Table of contents | Publisher description Availability: Items available for loan: Pakistan Navy Engineering College (PNEC)Call number: 621.381 LAU (2).
Flip Chip technologies

by Lau, JOhn H.

Publisher: N Y McGraw-Hill 1996Availability: Items available for loan: College of Aeronautical Engineering (CAE) (1).
Electronics manufacturing, with lead free halogen free and conductive adhesive materials

by Lau, John .H, Wong, C.P, Lee, N.C.

Material type: Text Text; Format: print ; Literary form: Not fiction Publisher: USA MCGRAW HILL 2003Availability: Items available for loan: College of Electrical & Mechanical Engineering (CEME)Call number: 621.381 LAU (1).
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