High-speed VLSI interconnections (E Book) [Elektronisk resurs] / Ashok K. Goel.

By: Goel, Ashok KSeries: Wiley series in microwave and optical engineering: Publisher: Hoboken, N.J. : Wiley-Interscience : IEEE Press, c2007Edition: 2nd edDescription: 1 online resource (xix, 407 p.) : illISBN: 9780470165973; 9780470165973Subject(s): COMPUTERS -- Logic Design | Integrated circuits -- Very large scale integration -- Computer simulation | Semiconductors -- Junctions | TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- Logic | TECHNOLOGY & ENGINEERING -- Electronics -- Circuits -- VLSI & ULSI | Very high speed integrated circuits -- Defects -- Mathematical models | Very high speed integrated circuits -- Mathematical modelsGenre/Form: Electronic books. | Electronic books.DDC classification: 621.39/5 Online resources: John Wiley | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online | Click here to access online
Contents:
High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX;
Summary: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par.
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Item type Current location Home library Collection Call number URL Status Date due Barcode Item holds
Book Book Military College of Signals (MCS)
Military College of Signals (MCS)
NFIC 621.395 (Browse shelf) Link to resource Available MCSEB-1756
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High-Speed VLSI Interconnections; Contents; PREFACE; 1 Preliminary Concepts and More; 2 Parasitic Resistances, Capacitances, and Inductances; 3 Interconnection Delays; 4 Crosstalk Analysis; 5 Electromigration-Induced Failure Analysis; 6 Future Interconnections; INDEX;

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections. In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a par.

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