000			02097nam a22001577a 4500
082			_a670
100			_aJamil, Atif _9119624
245			_aTopology Optimization of High-Power Electronics Enclosures using Generative Design & Additive Manufacturing / _cAtif Jamil
264			_aIslamabad : _bSMME- NUST; _c2023.
300			_a63p. _bSoft Copy _c30cm
520			_aThe development of electronic devices towards high performance and miniaturization has led to an increase in the heat dissipation problem. Traditional air-cooling methods are no longer sufficient to meet the high-density heat dissipation requirements. The thermal design optimization of heat sinks is necessary to minimize size and weight and improve heat removal, which can increase the speed of electronic devices. The use of sophisticated technology and proper design of heat sinks is crucial to avoid overheating and damage to electronic components. Porous metal has been shown to enhance forced convection heat transfer for better heat removal. However, the highpressure drop associated with porous medium also needs to be considered in the design. The effective thermal management of heat sinks is a priority concern for researchers as overheating can threaten chip reliability and lifespan. The average heat flux of chips has increased from 50 W/cm2 in 2010 to 250 W/cm2 in 2012, which highlights the importance of effective thermal management. In addition, the use of micro-channel compact heat exchangers and flow boiling in mini- and micro channels have been suggested as effective cooling methods for high power density devices such as Micro Electromechanical Systems (MEMS), microprocessors, laser diode arrays and Light Emitting Diodes (LEDs). In this study, we will be investigating the effect of nontraditional geometries of heat-sinks for high power electronics used in aerospace applications.
650			_aMS Design and Manufacturing Engineering _9119567
700			_aSupervisor : Dr. Syed Hussain Imran Jaffery
856			_uhttp://10.250.8.41:8080/xmlui/handle/123456789/37551
942			_2ddc _cTHE
999			_c607286 _d607286