Introduction to semiconductor technology (Record no. 355457)

000 -LEADER
fixed length control field 01859cam a2200349 a 4500
001 - CONTROL NUMBER
control field 10190379
003 - CONTROL NUMBER IDENTIFIER
control field Nust- CAS-E
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20180118181402.0
006 - FIXED-LENGTH DATA ELEMENTS--ADDITIONAL MATERIAL CHARACTERISTICS
fixed length control field m d
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr n
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 120502s2012 waua sb 001 0 eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9780819490926
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 081949092X
035 ## - SYSTEM CONTROL NUMBER
System control number (WaSeSS)ssj0000819238
040 ## - CATALOGING SOURCE
Original cataloging agency DLC
Transcribing agency DLC
Modifying agency DLC
-- WaSeSS
050 #4 - LIBRARY OF CONGRESS CALL NUMBER
Classification number TK7871.85
Item number .X53 2012
082 00 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815/2
Edition number 23
Author Mark XIA 2012
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Xiao, Hong.
210 10 - ABBREVIATED TITLE
Abbreviated title Introduction to semiconductor technology
245 10 - TITLE STATEMENT
Title Introduction to semiconductor technology
Medium [electronic resource] /
Statement of responsibility, etc. Hong Xiao.
250 ## - EDITION STATEMENT
Edition statement 2nd ed.
260 ## - PUBLICATION, DISTRIBUTION, ETC.
Place of publication, distribution, etc. Bellingham, Wash. :
Name of publisher, distributor, etc. SPIE,
Date of publication, distribution, etc. c2012.
504 ## - BIBLIOGRAPHY, ETC. NOTE
Bibliography, etc. note Includes bibliographical references and index.
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.
506 ## - RESTRICTIONS ON ACCESS NOTE
Terms governing access License restrictions may limit access.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Semiconductors
General subdivision Design and construction.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name entry element Semiconductor industry.
773 #0 - HOST ITEM ENTRY
Title SPIE Digital Library (Books)
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier <a href="http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379">http://www.columbia.edu/cgi-bin/cul/resolve?clio10190379</a>
Public note Full text available from SPIE Digital Library (Books)
910 ## - USER-OPTION DATA (OCLC)
User-option data Library of Congress record
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Koha item type Book
Holdings
Withdrawn status Lost status Source of classification or shelving scheme Damaged status Not for loan Collection code Permanent Location Current Location Shelving location Date acquired Source of acquisition Total Checkouts Full call number Barcode Date last seen Price effective from Koha item type
            US-Pakistan Center for Advanced Studies in Energy (USPCAS-E) US-Pakistan Center for Advanced Studies in Energy (USPCAS-E) General Stacks 11/11/2013 Eagle Information Books   621.3815/2 XIA 2012 CAS-E0000442 08/27/2014 08/27/2014 Book
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