Introduction to semiconductor technology [electronic resource] / Hong Xiao.

By: Xiao, HongMaterial type: TextTextPublisher: Bellingham, Wash. : SPIE, c2012Edition: 2nd edISBN: 9780819490926; 081949092XSubject(s): Semiconductors -- Design and construction | Semiconductor industryDDC classification: 621.3815/2 LOC classification: TK7871.85 | .X53 2012Online resources: Full text available from SPIE Digital Library (Books)
Contents:
Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.
SPIE Digital Library (Books)
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Item type Current location Home library Collection Shelving location Call number Status Date due Barcode Item holds
Book Book US-Pakistan Center for Advanced Studies in Energy (USPCAS-E)
US-Pakistan Center for Advanced Studies in Energy (USPCAS-E)
NFIC General Stacks 621.3815/2 XIA 2012 (Browse shelf) Available CAS-E0000442
Total holds: 0

Includes bibliographical references and index.

Preface to the first edition -- Preface to the second edition -- Chapter 1. Introduction -- Chapter 2. Introduction to integrated circuit fabrication -- Chapter 3. Semiconductor basics -- Chapter 4. Wafer manufacturing, epitaxy, and substrate engineering -- Chapter 5. Thermal processes -- Chapter 6. Photolithography -- Chapter 7. Plasma basics -- Chapter 8. Ion implantation -- Chapter 9. Etch -- Chapter 10. Chemical vapor deposition and dielectric thin films -- Chapter 11. Metallization -- Chapter 12. Chemical mechanical polishing -- Chapter 13. Process integration -- Chapter 14. Integrated circuit processing technologies -- Chapter 15. Future trends and summary -- Index.

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